Electronic component device and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 29, 2003
Grant Date -
Feb 21, 2002
app pub date -
May 14, 2001
filing date -
May 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.
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