Method and device for exposing a substrate to light
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United States of America Patent
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Jul 29, 2003
Grant Date -
N/A
app pub date -
Sep 21, 2000
filing date -
Nov 18, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a method for exposing a substrate (1) equipped with an n-layer photoresist system (2), an electrically conductive connection being created between a ground potential and the substrate (1) and/or at least one of the layers S.sub.1 through S.sub.n of the photoresist system (2). The invention furthermore concerns an arrangement for carrying out said method. According to the present invention, what is achieved in a single process step is that by way of spring elements E.sub.1 through E.sub.4, a contact tip K.sub.1 is advanced as far as the layer S.sub.1, a contact tip K.sub.2 is advanced through the layer S.sub.1 as far as the layer S.sub.2, a contact tip K.sub.3 is advanced through the layer S.sub.1 and S.sub.2 as far as the layer S.sub.3, and so forth. The electrical charges from the layer S.sub.1 are dissipated to the ground potential via the contact tip K.sub.1, the charges from the layer S.sub.2 via the contact tip K.sub.2, etc., and/or and from the substrate (1) via a contact tip K.sub.4.
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