Method of preparing photosensitive resin composition

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United States of America Patent

PATENT NO 6600053
APP PUB NO 20020037991A1
SERIAL NO

09941703

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Abstract

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A 6,6'-dialkyl-3,3',4,4'-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern. ##STR1## wherein Y is a divalent organic group, R.sup.7 and R.sup.8 are OH or a monovalent organic group, R.sup.9 and R.sup.10 are a monovalent hydrocarbon group, R.sup.11, R.sup.12 and R.sup.13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTDBUNKYO-KU TOKYO 112-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Noriyoshi Hitachi, JP 10 29
Hagiwara, Toshiki Sagamihara, JP 7 39
Kaji, Makoto Hitachi, JP 44 297
Sasaki, Akihiro Hitachi, JP 42 471

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