Wrought processing of brittle target alloy for sputtering applications
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United States of America Patent
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Jul 29, 2003
Grant Date -
Jan 10, 2002
app pub date -
Oct 1, 1999
filing date -
Oct 1, 1999
priority date (Note) -
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Abstract
An ingot of material which is normally too brittle to allow successful rolling and wrought processing is formed so as to have a thickness-to-width ratio of less than about 0.5 and is annealed in a temperature range of 1000.degree. F. to 2500.degree. F. for a preselected time. The ingot is then rolled in a temperature range of 1500.degree. F. to 2500.degree. F. Additional/optional annealing of the resulting rolled plate in a temperature range of 500.degree. F. to 2000.degree. F., or between room temperature and 1500.degree. F., and/or a final annealing between 500.degree. F. and 1500.degree. F., is possible. Sputtering targets are cut out of the rolled plate and used for the manufacture of storage disks.
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