Optical/electrical interconnects and package for high speed signaling
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United States of America Patent
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Jul 29, 2003
Grant Date -
Mar 13, 2003
app pub date -
Sep 12, 2001
filing date -
Sep 12, 2001
priority date (Note) -
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Abstract
An opto-electrical printed circuit board (PCB) and compatible opto-electrical package. The PCB includes a base material, one or more optical fibers imbedded in or on top of the base material, and one or more transparent substrates imbedded in or on top of the base material covering the optical fibers. The optical fibers provide a high speed interconnect between two or more electronic devices attached to the PCB. The electronic devices interface to the optical fibers through the transparent substrate. The opto-electrical package includes a base material, an optical receiver and an optical transmitter attached to the bottom side of the base material, an encapsulating polymer that covers the optical receiver and optical transmitter, and one or more power and ground connection points attached to the bottom side of the base material.
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