Temperature control unit for dies or molds, particularly for pressure die-casting or injection-molding aluminum and alloys thereof, plastic materials and the like
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 29, 2003
Grant Date -
N/A
app pub date -
Apr 10, 2000
filing date -
Apr 16, 1999
priority date (Note) -
Expired
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Abstract
A temperature control unit for dies and molds, particularly for pressure die-casting or injection-molding of aluminum and alloys thereof, plastic materials and the like, comprising a die or mold cooling circuit through which pressurized water flows. A water feed pump is connected to the circuit and is adjustable to a pressure which is higher than the evaporation pressure of water at a preheating temperature of the water, which can be detected by a first sensor for detecting the temperature of the water. The circuit includes a circulation pump, a water overflow valve which can be set to a lower pressure than the feed pump, and a heating unit which is controlled by the first temperature sensor. A die or mold temperature sensor is further provided which controls the feed pump.
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