Holographic scatterometer for detection and analysis of wafer surface deposits
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United States of America Patent
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Jul 22, 2003
Grant Date -
Oct 31, 2002
app pub date -
Mar 22, 2001
filing date -
Mar 22, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A holographic scatterometer with continuous readout can rapidly identify the presence of deposits (particles or other defects) on an unpatterned wafer surface and determine the volume density (size) and location. The scatterometer can also determine chemical composition of the detected deposits. The range of the deposit (particle) size to be measured is below 80 nm, which currently existing scatterometer type instruments cannot readily detect. The inspection can be achieved as an in-line stage during the processing of wafers or in situ in combination with another processing tool or as a separate off-line analysis device.
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