Heat sink assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6595275
SERIAL NO

10187290

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation assembly includes a base with a ridge and multiple fins mounted on top of the base. Each of the fins has a plate with a cutout defined in a mediate portion of a bottom edge to correspond to the ridge of the base, two first bends respectively extending from opposite sides of the cutout in a same direction from the bottom edge and a second bend formed on a top edge of the cutout. The fins are able to be securely mounted on top of the base via the two first bends.

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Patent Owner(s)

Patent OwnerAddress
WAFFER TECHNOLOGY CORPNO 2 TA-CHIH RD TAOYUAN CITY 330 R O C
WANG JACKNO 2 TA-CHIH RD TAOYUAN CITY 330 R O C

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Cheng-Hua Taoyuan, TW 11 132
Lin, Michael Taoyuan, TW 104 2099
Ma, Charles Taoyuan, TW 22 253
Wang, Jack 2, Ta-Chih Rd., Taoyuan City, Taoyuan Hsien, TW 74 1028

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