Apparatus for clamping a planar substrate
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United States of America Patent
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Jul 15, 2003
Issued Date -
N/A
app pub date -
Jan 25, 2001
filing date -
Apr 9, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The disclosure relates to an apparatus for electrostatically adhering grains to a planar substrate comprising: a. an electrostatic chuck having a collection surface with at least one grain collection zone for, when the planar substrate is layered on the collection surface, electrostatically directing charged grains to a corresponding surface on the planar substrate; and b. a pattern of holes through the electrostatic chuck allowing a source of low pressure to act through the electrostatic chuck to adhere the planar substrate.
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