Sensor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 8, 2003
Grant Date -
Dec 5, 2002
app pub date -
May 20, 2002
filing date -
Jun 1, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a sensor device in which an IC module having a sensing portion at its top end is housed and fixed in a housing made of a synthetic resin, and a pair of leads are connected at one end of them to the IC module in the housing, the sensor device including a holder assembly comprising a first holder having a containment recess for containing the IC module while retaining the top end of the IC module, and an insert hole leading to the containment recess for allowing the IC module to be inserted to the containment recess, and a second holder having a partition wall disposed between the pair of leads connected to the rear end of the IC module, inserted in the insert hole of the first holder, and retaining the rear part of the IC module in cooperation with the first holder, the IC module being contained in the containment recess and the holder assembly being covered by the housing, whereby it is possible to simplify the structure of assembling the second holder to the first holder, and simplify the operation of assembling the IC module to the holder assembly, thereby enabling to easily manufacture the sensor device.
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