Method of making a copper on INVAR.RTM. composite
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United States of America Patent
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Jul 8, 2003
Grant Date -
Feb 13, 2003
app pub date -
Aug 9, 2001
filing date -
Aug 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR.RTM. sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1.mu. and 50.mu., wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0.degree. F. and 200.degree. F.
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