Device for processing wafer
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United States of America Patent
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-
Jul 8, 2003
Grant Date -
N/A
app pub date -
Aug 11, 2000
filing date -
Dec 11, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device for processing a substrate comprises a processing vessel (1), an outer vessel (2) for surrounding the processing vessel (1) which outer vessel (2) can be sealed, a first supporting member (4) for bringing the substrate (3) into and out from the processing vessel (1) which first supporting member (4) supports the substrate (3) in a standing manner, and a second supporting member (5) for transferring the substrate (3) between the first supporting member (4) which second supporting member (5) is movable up and down within the processing vessel (1). The device processes the entire surface of the substrate (3) uniformly and prevents varying in processing from occurrence.
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