High conductivity copper/refractory metal composites and method for making same
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United States of America Patent
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Jul 8, 2003
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N/A
app pub date -
May 16, 2000
filing date -
May 16, 2000
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Expired
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Abstract
The thermal conductivity, thermal conductivity, of a sintered copper/refractory metal composite having a maximum porosity of about 1% is greatly improved when the composite contains phosphorus and sintering aid in a specified weight ratio, 'phosphorus/sintering aid ratio.' The copper/refractory matrix composite herein comprises, by weight, from about 5% to about 30% copper, from about 0.2% to about 0.6% sintering aid, from about 0.08% to about 0.3% phosphorus, the remaining metal is refractory metal. The phosphorus to sintering aid ratio ranges from about 0.25 to about 0.55. In one embodiment of the invention the sintering aid contains cobalt and the refractory metal is tungsten.
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