Circuit housing clamp and method of manufacture therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 1, 2003
Grant Date -
Jan 2, 2003
app pub date -
Jun 29, 2001
filing date -
Jun 29, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.
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