Etchant
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United States of America Patent
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Jul 1, 2003
Grant Date -
N/A
app pub date -
Mar 26, 1999
filing date -
Dec 18, 1996
priority date (Note) -
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Abstract
An etching treatment agent which can etch insulating film with high speeds without damaging the resist pattern, provide realistic throughput when the insulting film etching process in the semiconductor manufacturing process is replaced with the single wafer processing etching treatment method, and prevent roughness on the surface of the semiconductor after etching.
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