Method of inspecting pattern and inspecting instrument

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6583414
APP PUB NO 20010017878A1
SERIAL NO

09725900

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There are provided an inline inspection system and inspection method for inspecting the substrate surface on which semiconductors and circuit patterns are formed by radiating thereto white beam, laser beam or electron beam, and reviewing, inspecting and discriminating the detected roughness and figure defect, particle and moreover electrical defect on the surface with higher accuracy within a short period of time with the same instrument. Thereby, automatic movement to the position to be reviewed, acquisition of image and classification can be realized. On the occasion of identifying the position to be reviewed on a sample and forming an image through irradiation of electron beam on the basis of the positional information of defect detected with the other inspection instrument, an electrical defect can be reviewed with the voltage contrast mode by designating the electron beam irradiation condition, detectors and detecting condition depending on a kind of defect to be reviewed. The image obtained is automatically classified in the image processing unit and the result is then additionally output to the defect file.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO 100-8280
HITACHI TOKYO ELECTRONICS CO LTDOME-SHI TOKYO 198-8532

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Koji Hitachinaka, JP 340 2689
Hijikata, Shigeaki Ome, JP 6 81
Nishiyama, Hidetoshi Kokubunji, JP 131 2044
Nozoe, Mari Hino, JP 81 1767
Watanabe, Kenji Ome, JP 546 8684

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