Hot melt adhesive composition comprising homogeneous ethylene interpolymer and block copolymer
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United States of America Patent
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Jun 24, 2003
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Jun 30, 1999
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Mar 14, 1996
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Abstract
A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm.sup.3 ; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.
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