Polyimide coating process with dilute TMAH and DI-water backrinse
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 24, 2003
Issued Date -
N/A
app pub date -
Jul 18, 2000
filing date -
Aug 5, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus is disclosed for coating a semiconductor wafer with polyimide so that excess polyimide is removed from the wafer edge, back side and coating process area and is conveniently drained. A developer, such as dilute TMAH, that mixes with the excess polyimide is injected into a chamber. The soluble mixture of TMAH and excess polymide may then be drained into a bulk drain, obviating the accumulation of excess polymide in the coater cup. The method is implemented through an assembly that includes a coater cup, spin chuck disposed within the coater cup, and a pair of nozzles intruding into the coater cup at a lower portion of the cup. A fist nozzle operates to inject developing fluid onto the back side of the wafer in the cup, and a second nozzle, positioned nearer the center of the cup and the spin chuck, operates to inject rinsing fluid.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully