Die bonding device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 24, 2003
Grant Date -
Jan 9, 2003
app pub date -
Jan 23, 2002
filing date -
May 26, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.
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