Method of making electronics package with specific areas having low coefficient of thermal expansion
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United States of America Patent
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Jun 17, 2003
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N/A
app pub date -
Aug 15, 2002
filing date -
Feb 21, 2002
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Abstract
Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.
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