Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
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United States of America Patent
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Jun 17, 2003
Grant Date -
Aug 22, 2002
app pub date -
Nov 27, 2001
filing date -
Nov 29, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam polymers, used in polishing applications. The chemical and mechanical properties thermoplastic foam substrates can be transformed by inorganic, inorganic-organic, and or organic--organic grafting techniques, such that the polymer foam is endowed with new set of properties that more desirable and suitable for polishing.
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