Method for the production of substrates, magnetron source and sputter-coating chamber
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United States of America Patent
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Jun 17, 2003
Grant Date -
Sep 20, 2001
app pub date -
Feb 1, 2001
filing date -
Feb 4, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A target of an alloy of metals having different specific weights is used in a method for producing substrates that are coated with a layer comprising the same two metals by magnetron sputtering of the target. When sputtering such a target material, the metals of the alloy will sputter off with different sputtering characteristics with regard to a static angle .alpha. at which the sputtered off material leaves the target. For this reason, at the substrate to be sputter-coated, there occurs a demixing effect of these metals which will be deposited with a varying local ratio of the metals, that differs form the ratio of the metals in the alloy of the target. To counter-act this demixing phenomenon, the location of an electron trap formed by the magnetron field of the sputter source at the target with respect to the location of the substrate, is selected. By proving this electron trap and the resulting erosion profile on the target, the amount of deposited heavier metal to the amount of lighter metal is increased along the surface of the substrate.
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