High thermal conductivity lossy dielectric using co-densified multilayer configuration
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United States of America Patent
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Jun 17, 2003
Grant Date -
Aug 23, 2001
app pub date -
Apr 18, 2001
filing date -
Sep 17, 1999
priority date (Note) -
Expired
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Abstract
Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.
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