Metal-bonded grinding tool and manufacturing method therefor
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United States of America Patent
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Jun 17, 2003
Grant Date -
N/A
app pub date -
Jul 7, 2000
filing date -
Jul 9, 1999
priority date (Note) -
Expired
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Abstract
A metal-bonded grinding tool including a base, and abrasive grains bonded to the base by a bond matrix containing Cu alloy as a main component. The bond matrix further contains a powder selected from the group consisting of Ti, Al, and a mixture thereof. An average grain protrusion is set to 30% or more of an average grain diameter, and an average grain spacing is set to 200% or more of the average grain diameter.
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