Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
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United States of America Patent
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Jun 10, 2003
Issued Date -
N/A
app pub date -
Jul 3, 2002
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a semiconductor chip assembly includes providing a semiconductor chip, a metal base, an insulative base and a conductive trace, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, and the conductive trace includes a contact terminal that extends through the insulative base, then forming an opening that extends through the metal base and the insulative base, exposes the pad and is spaced from the contact terminal, then forming a connection joint that contacts and electrically connects the conductive trace and the pad, and then removing a portion of the metal base that contacts the contact terminal. Preferably, the opening extends through an insulative adhesive that attaches the chip to the conductive trace.
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