Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 10, 2003
Grant Date -
N/A
app pub date -
Mar 4, 2002
filing date -
Mar 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed, in general, to polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to polishing pads containing a precursor slurry modifier. In the presence of a polishing slurry during chemical mechanical polishing, the precursor is released to the polishing slurry to form a slurry modifier thereby improving polishing.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully