Enclosure with RF isolation for circuit packs
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United States of America Patent
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-
Jun 3, 2003
Grant Date -
N/A
app pub date -
Mar 8, 2002
filing date -
Mar 8, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An enclosure includes spaced apart sidewalls and a bottom wall, rear wall, and top cover each forming an RF tight seal with the sidewalls, and defining separate chambers for a plurality of circuit packs. The edges of the sidewalls, bottom wall and top cover at the entrance to each chamber are configured to form an RF tight seal with the faceplate of an installed circuit pack. A fluid for cooling the circuit pack enters each chamber and a baffle allows the fluid to escape while being resistant to the transmission of RF energy. Surfaces of the sidewalls that are interior to each chamber are able to disrupt and absorb a substantial portion of the RF energy radiating from the enclosed circuit pack and thereby minimize the level of RF energy within the chamber.
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