Method and apparatus for controlling contamination during the electroplating deposition of metals onto a semiconductor wafer surface
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United States of America Patent
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Jun 3, 2003
Grant Date -
Apr 3, 2003
app pub date -
Sep 28, 2001
filing date -
Sep 28, 2001
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Abstract
A method and apparatus for the electroplating deposition of a metal onto a semiconductor wafer surface (29), including vibrationally scrubbing the wafer surface (29) during an electroplating process. At least one transducer (32) is mounted to a wall (33) of an electroplating tool chamber (22). The transducer (32) intermittently delivers sonic energy pulses lasting for one to two seconds to the electroplating solution during the electroplating process.
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