Reworkable thermosetting resin compositions
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United States of America Patent
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Jun 3, 2003
Grant Date -
N/A
app pub date -
Apr 2, 2002
filing date -
Aug 13, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
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