High speed electronic assembly system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 3, 2003
Grant Date -
N/A
app pub date -
Dec 21, 2000
filing date -
Dec 21, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.
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