Method of and apparatus for chemical-mechanical polishing
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United States of America Patent
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Jun 3, 2003
Grant Date -
Dec 5, 2002
app pub date -
May 31, 2001
filing date -
May 31, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.
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