Opto-electronic device having staked connection between parts to prevent differential thermal expansion
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United States of America Patent
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Jun 3, 2003
Issued Date -
N/A
app pub date -
Mar 12, 2001
filing date -
Jul 2, 1999
priority date (Note) -
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Abstract
An opto-electronic device is provided wherein an optical assembly having a first coefficient of thermal expansion is connected to a substrate having a second, different coefficient of thermal expansion. A plurality of stakes are either separately inserted or integrally formed-in the optical assembly and extend through and are adhesively bonded to passageways formed in the substrate. The stakes reduce or prevent differential thermal expansion that would otherwise occur as the device heats up during operation. The substrate may be thermally connected to a metallic housing for the device to increase transfer of unwanted heat into the ambient atmosphere.
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