Indium plated package for an optical component and process therefore
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United States of America Patent
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May 20, 2003
Grant Date -
N/A
app pub date -
Oct 25, 2000
filing date -
Oct 25, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device capable of receiving an optical fiber through an orifice in the housing of the device. The housing having a gold surface over a substrate material. An indium layer is located on the gold surface. A solder joint is formed with the indium layer covering the gold surface to have indium silver solder surrounding the fiber and maintaining the fiber in a desired position with the housing. The indium layer can be formed of pure indium and the solder joint is formed of indium silver solder having about 97% indium and about 3% silver. The fiber or fibers may be metallized with a pure indium coating. The indium silver solder joint can provide an improved hermetic seal at fiber entrances and exits of the device.
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