Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method
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United States of America Patent
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May 20, 2003
Grant Date -
Feb 28, 2002
app pub date -
Jul 6, 2001
filing date -
Jul 11, 2000
priority date (Note) -
Expired
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Abstract
The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MH.sub.z to 30 GH.sub.z frequency.
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