Multilayer ceramic wiring board and process for producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 20, 2003
Grant Date -
Jul 18, 2002
app pub date -
Nov 28, 2001
filing date -
Nov 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer ceramic wiring board prepared from a plurality of sheets formed from a ceramic-incorporating material containing a ceramic powder and a binder resin and each having a pattern of one or a plurality of circuit elements printed on a surface thereof with use of a conductive mixture material containing an electrically conductive powder and a binder resin, by placing the sheets over one another to form a laminate, and compressing and firing the laminate. The mean particle size Rs of the ceramic powder is not greater than the value of (Rd-.sigma.d) wherein Rd is the mean particle size of the conductive powder, and .sigma.d is the standard deviation obtained when the distribution of the particle sizes of the conductive powder is expressed by a normal distribution function. This feature prevents formation of projections which would otherwise extend from the surface of one circuit element toward another circuit element when the elements are formed by firing the laminate.
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