Hole filling method for a printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 20, 2003
Grant Date -
Feb 14, 2002
app pub date -
Aug 8, 2001
filing date -
Aug 9, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
On carrying out a hole filling method for a printed wiring board having an interlayer connection hole, first and second printed wiring boards (1 and 2) are prepared, each of which has the interlayer connection hole. The first printed wiring board is placed on a bottom plate (7). On the first printed wiring board, a first hole guide plate (8) having a first guide hole formed at a position corresponding to the interlayer connection hole of the first printed wiring board is placed in such a manner that the first guide hole is coincident with the interlayer connection hole of the first printed wiring board. A hole filling resin (9) is superposed on the first hole guide plate. On the hole filling resin, a second hole guide plate (10) having a second guide hole formed at a position corresponding to the interlayer connection hole of the second printed wiring board is placed. On the second hole guide plate, the second printed wiring board is placed in such a manner that the interlayer connection hole of the second printed wiring board is coincident with the second guide hole of the second hole guide plate. A top plate (11) is placed on the second printed wiring board to form a stacked assembly which includes the first printed wiring board, the first hole guide plate, the hole filling resin, the second hole guide plate, and the second printed wiring board between the bottom plate and the top plate. The stacked assembly is vacuum-pressed between the bottom plate and the top plate to simultaneously fill the interlayer connection holes of the first and the second printed wiring boards with a part of the hole filling resin.
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