Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
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United States of America Patent
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May 6, 2003
Grant Date -
N/A
app pub date -
May 26, 2000
filing date -
Nov 28, 1997
priority date (Note) -
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Abstract
The surface mounting of a backset microwave package on a printed circuit. After the package has been accurately positioned against the printed circuit the connections are produced by soldering the conducting elements in direct contact. A chip is enclosed in a sort of cage constituting a screen which replaces a conventional cover, the cage is formed by layouts borne respectively by the package and the printed circuit and is linked together by metal links. The surface mounting is particularly applicable to packages operating in millimetric microwaves.
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