Jet coating method for semiconductor processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 6, 2003
Issued Date -
N/A
app pub date -
May 31, 2000
filing date -
Jun 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system and method is disclosed for coating a conventional wafer or a spherical shaped semiconductor substrate with liquid material such as photoresist by utilizing a 'drop on demand' piezo driven dispense nozzle, a bubble-jet dispense nozzle, or a continuous piezo jet with charging electrodes. The proposed system and method will greatly reduce, and in some cases virtually eliminate, the waste of photoresist in the process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully