Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure
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United States of America Patent
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May 6, 2003
Grant Date -
N/A
app pub date -
Jun 28, 2000
filing date -
Feb 23, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed are a curable polyphenylene ether (PPE) resin composition comprising (a) a PPE resin and (b) a of a compound having a 3,4-dihydro-3-substituted-1,3-benzoxazine skeleton (DSBS compound), or a mixture of the DSBS compound and a ring-opening polymerization re-action product thereof; a cured PPE resin composition obtainable by curing the curable PPE resin composition; and a laminate structure obtained by using the curable or cured PPE resin composition. The curable PPE resin composition exhibits, after cured, excellent chemical resistance, moisture resistance, dielectric characteristics, heat resistance, flame retardancy and dimensional stability, so that it can be used as a dielectric, insulating or heat resistant material in the electrical, electronic, space and aircraft industries. Especially, it can be advantageously used as a resin composition for forming insulating layers, such as substrates for a single-sided, double-sided or multi-layer printed circuit board, a flexible printed circuit board and a semi-rigid circuit board, and a substrate for a structure having excellent heat removal characteristics.
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