Method of molding a peripherally encapsulated product under heat and pressure utilizing sheet molding compound (SMC) or bulk molding compound (BMC)
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United States of America Patent
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May 6, 2003
Grant Date -
N/A
app pub date -
Mar 29, 1999
filing date -
Mar 29, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A peripherally encapsulated product, such as an oven door outer shell, is molded in accordance with this invention by placing a piece of glass between mold clamping portions of relatively movable closed bodies when the latter are in an open position. Preferably both bodies are heated and thermosetting polymeric material (SMC or BMC) is placed upon selected areas of one of the mold bodies within and about an area corresponding to an annular mold cavity and outboard of a peripheral edge of a piece of glass. The glass is clamped between mold clamping portions of the mold bodies which are then progressively closed creating compression forces which extrude the thermosetting polymeric material into the annular cavity and into complete encapsulation of the continuous peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom. The encapsulated product can be provided with post-formed vent openings and/or handle attaching openings or the handle can be integrally molded during the molding process.
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