Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 29, 2003
Grant Date -
Nov 22, 2001
app pub date -
May 16, 2001
filing date -
May 16, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7'), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity (20), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard (40).
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