Flip-chip assembly of semiconductor devices using adhesives
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United States of America Patent
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Apr 29, 2003
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N/A
app pub date -
Feb 9, 2001
filing date -
Feb 9, 2000
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Abstract
The present invention is related to a flip-chip-on-board (FCOB) assembly technology applicable for mounting large chips with high I/O count or small pitch, mounted on low-cost or low-grade substrates. The assembly technology uses both an isotropically conductive adhesive (ICA) and a non-conductive material (NCA) in the same assembly cycle. The thermocompression step establishes at the same time the electrical and mechanical interconnections and the curing of the adhesives.
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