Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
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United States of America Patent
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Apr 22, 2003
Grant Date -
May 2, 2002
app pub date -
Apr 20, 2001
filing date -
Jul 10, 2000
priority date (Note) -
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Abstract
An apparatus and method for controlling temperature in a device under test (DUT) having an integrated circuit chip die includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the chip die. A sensing circuit senses a signal from the diode indicative of temperature of the chip die. The sensing circuit can be part of a testing circuit in a system being used to test the DUT. The sensing circuit sends a control signal to a temperature control system used to control the temperature of a DUT temperature control medium. The temperature control medium can be, for example, a stream of temperature-controlled air directed onto the package of the DUT. In response to the control signal, the temperature control system controls the temperature of the air at a desired temperature to control the temperature of the DUT.
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