Mounting structure of electronic component on substrate board
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United States of America Patent
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-
Apr 15, 2003
Grant Date -
Oct 4, 2001
app pub date -
May 17, 2001
filing date -
Jul 24, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.
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