Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
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United States of America Patent
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Apr 15, 2003
Grant Date -
Apr 18, 2002
app pub date -
Aug 9, 2001
filing date -
Aug 24, 2000
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Expired
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Abstract
A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4'-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
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