Chemical/mechanical polishing endpoint detection device and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 15, 2003
Grant Date -
N/A
app pub date -
Oct 5, 2000
filing date -
Oct 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device (28) and method for detecting endpoints (Ep1, Ep2) of a chemical-mechanical polishing (CMP) process for semiconductor wafers (14). A carrier current signal driving a polishing carrier motor is received and detected, the carrier current signal is modified, and the modified carrier current is analyzed to detect at least one endpoint of the polishing process. The device (28) includes a detector (40), a logic circuit (42) and storage (44).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully