Package structure and method for a card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 15, 2003
Grant Date -
Sep 12, 2002
app pub date -
Apr 30, 2001
filing date -
Mar 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A package structure and method for a card comprises respective attachment of first and second conductive covers each having a vertical piece extending on one side thereof with first lateral surface of first and second plastic frames in use of a low temperature adhesive therebetween to form first and second half cases, and combination of the first and second half cases with insertion of another adhesive or sonic welding between second lateral surfaces of the first and second plastic frames. The plastic frame also has an outer surface formed with a recess to accommodate the vertical piece of the conductive cover and an adhesive area on the first lateral surface formed deep into the plastic frame to be coated with the low temperature adhesive in order for the attachment of the conductive cover. Each of the first and second plastic frames is further formed with a trench or through hole for clamping a conductive piece with a hook shape in contact with the conductive cover and the other conductive piece on the other plastic frame.
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