Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode

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United States of America Patent

PATENT NO 6545494
SERIAL NO

09612667

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus and method for controlling temperature in a wafer on a wafer chuck includes a temperature sensing device, such as a temperature sensitive diode, integrally formed in the wafer. A sensing circuit senses a signal from the diode indicative of temperature of the wafer. The sensing circuit can be part of a testing circuit in a wafer prober being used to test integrated circuits on the wafer. The sensing circuit sends a control signal to a temperature control system used to control the temperature of the chuck. In response to the control signal, the temperature control system controls the temperature of the chuck at a desired temperature to control the temperature of the wafer. The wafer can include multiple integrated circuit die, and each circuit can include its own temperature sensing diode. As a result, extremely accurate and individualized temperature testing can be performed on each integrated circuit on the wafer.

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Patent Owner(s)

  • TEMPTRONIC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Olsen, Douglas S Natick, MA 12 141
Stura, David North Billerica, MA 3 70

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