Semiconductor device fabricated on multiple substrate
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United States of America Patent
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Apr 8, 2003
Grant Date -
Oct 10, 2002
app pub date -
May 31, 2002
filing date -
Mar 30, 2001
priority date (Note) -
Expired
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Abstract
A semiconductor device fabricated on a multiple substrate with a first structure including a first semiconductor substrate with at least one first bonding pad and at least one alignment key formed thereon, and a second structure including a second semiconductor substrate with at least one second bonding pad and at least one alignment aperture passing through the second semiconductor substrate. By irradiating a UV beam through the alignment aperture and detecting reflection off the alignment key, the first and second semiconductor substrates are aligned.
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