Method for treating silicon-containing polymer layers with plasma or electromagnetic radiation
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United States of America Patent
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Apr 8, 2003
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N/A
app pub date -
Aug 18, 2000
filing date -
Jan 28, 1998
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Abstract
A silicon-containing polymer is deposited in a recess on the surface of the substrate. The substrate is then heated to a given temperature. The surface of the substrate, heated to the given temperature and having the silicon-containing polymer deposited thereon, is subjected to gas or vapor activated by a plasma or other electromagnetic radiation which is distinct from a source of heat used to heat the substrate to the given temperature.
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